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Cantilever Probe card Spec. |
Items |
Description |
Pad Configuration |
In line / Stagger / Tri-Tier / Quart-Tier / Shelf Build |
Pad Material |
Aluminum / Gold Bump |
Pad Pitch |
30 um (inner line) |
Pad Size |
20 * 40 um |
Probe Material |
Tungsten / Rhenium Tungsten / Be Cu / Palladium |
Test Temperature |
-40 ℃ ~ 150℃ |
Test Frequency |
Customerized |
Leakage (Signal pin) |
10 nA |
Contact Resistance |
3 Ohm (Ω) |
Planarity |
+ / - 0.2mils |
Alignment |
+ / - 0.2 mils |
Ring |
Ceramic / Aluminum / Per Customer Design |
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Items |
Description |
Pad Size (um) |
50~60um |
61~80um |
61~80um |
Isolation Resistance (Ω) |
> 5.0 E+12 |
Leakage |
< 1.0 E –12 |
Probe Force(g/mil) |
2 g / mils |
Tip Length(um) |
200um≦T/Length ≦300um |
Epoxy Clearance(mil) |
≧ 3 mil |
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Items |
Description |
Probe Type |
Rhenium Tungsten / Non-Clean Probe |
Pad Pitch ( Stagger ) |
18/36 um (Gold Bump) |
Leakage (Signal pin) |
10nA (at 10V) |
Contact Resistance |
5 ohm (Ω) |
Alignment |
≦ 0.15 mil |
Planarity |
≦ 0.15 mil |
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Vertical Probe Card Spec.
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Items |
Description |
Probe Diameter |
2mils/ 2.5mils / 3 mils |
Probe Type |
Cobra
Spring
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PCB Material |
FR4 / GeTek / Nelco / Rogers |
Test Temp. |
Ambient to 130 ℃ |
Pin Count |
Max. 7,000 pins/single dut |
Alignment |
+ / - 0.5 mils |
Planarity |
+ / - 0.5 mils |
BCF |
1.2g~3.5g / mil (base on probe diameter) |
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All the configuration and specification of the vertical probe card can be designed by customer requests. |
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我們提供的WLCSP solution 可採用 single pin 或是 Kelvin pin, 其他規格皆可客製化 |
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